DOWSIL 734 RTV Silicone Sealant
Free flowing
Self Levelling
Single Component
Room Temp Curing
FDA Approved
Potting-Coating
General Purpose-Seals-Bonds-Caulks
Fastens-Plugs-Dampens-Gaskets-Protects
Insulates-Repairs-Waterproofs & more
Best for Industrial use
Description ::
DOWSIL 734 RTV self-leveling adhesive/sealant resists
Weathering, moisture, vibration, ozone, and temperature extremes.
In addition, it stays flexible from -85 to 450 F (-65 to 232 C).
Important Features ::
A Dow Corning (owners of Silastic & Molykote Brands) product.
Ease of use - one part, no mixing required, Non shrinking.
Does not crack, crumble or dry out in direct Sunlight.
Excellent temperature range -65C to +232C.
Meets FDA requirement no. 21 CFR 177.2600 (formerly 121.2562) subject to end use compliance
with any applicable total extractive limitations.
Bonds almost all surfaces.
Chemically stable.
Colours ::
White.
Uses ::
Primarily used in application where a free-flowing, one part is needed.
Applications include potting electrical terminals, coating mechanical devices, Sealing
ammunition fuses, and making formed-in-place gaskets.
Limitations ::
On contact, uncured sealant may cause irritation, avoid contact with eyes and skin.
Packing ::
100 GM tube
Typical Properties ::
Flow, sag or sump - nil
Tack free time at 24C & 50 % RH - 20 min.
Cure time at 25C & 50 % RH - 24 hours
As cured - Physical Properties :
ASTM D 2240 - Durometer Hardness, Shore A - 24
ASTM D 412 - Ultimate Tensile Strength - 220 psi (mpa)
ASTM D 412 - Elongation % - 370
ASTM D 624 - Tear Strenght, die B, ppi (kN/m) - 20 (3.5)
ASTM D 746 - Brittle Point , degrees : -100 F (-73 C)
As cured - Electrical Properties :
Volume Resistivity at 73.4 +\- 3.6F (23 +/-2C) Ohm-cm = 1.7 x 10 (to the power 15)
Dielectric Constant at 100 Hz = 2.7
Dielectric Constnat at 1,00,000 Hz = 2.7
Disspitaion Factor at 100 Hz = 0.007
Disspitaion Factor at 1,00,000 Hz = 0.0006
Dielectric Strength at 77F ( 25C) 75 mil thickness = 450 volts/mil
Caution ::
Users are advised to conduct their own tests to check suitability to specific applications.